Micron, the leading American memory chip maker, announced its latest solution at the MWC 2024. The company this is the most compact UFS 4.0 package yet, standing at just 9 x 13 millimeters. It still offers offer up to 1 TB capacity and excellent performance – 4300 MB/s sequential read and 4000 MB/s sequential write speed.
The major reason Micron brought the smaller solution is feedback from smartphone OEMs, who said they wanted more room for larger batteries. The American company developed the product in its joint customer labs across the US, China, and Korea and built it on its 232-layer 3D NAND technology.
The footprint of the UFS 4.0 chip got 20% smaller, compared with the 11 x 13 mm solution, launched last June. This will reduce power usage without compromising overall performance. Micron brought HPM (High-Performance Mode), which is a proprietary feature that optimizes performance during intensive smartphone use, which is 25% improved speed when HPM is enabled.
Micron is now shipping samples of the new UFS 4.0 storage in three variations – 256 GB, 512 GB, and 1 TB.
